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halogen free

Coupled Power Inductors
LPD5030 Series

  • Coupled, low profile shielded power inductor – only 2.9 mm high, 4.8 mm square
  • Shielded coupled inductors for Flyback, SEPIC and other applications
  • See Selecting inductors for SEPIC and SEPIC Inductor Selector tool
  • Excellent coupling coefficient: K > 0.95
  • 100 V winding-to-winding isolation
  • RoHS-compliant, halogen free. 260°C compatible. Silver-palladium-platinum-glass frit terminations
  • COTS Plus tin-silver-copper and tin-lead terminations available

Photo    Pricing    Materials declaration    PDF data sheet

SPECIFICATIONS

 L vs Frequency     L vs Current     Current Derating     Core loss

Schematics    Dimensions     Tape and reel specifications     3D model
LPD5030-102NE_ 1.0 ±30% 0.042 156 0.97 0.09 4.6 4.8 5.0 2.60 3.68
LPD5030-152ME_ 1.5 ±20% 0.048 123 0.97 0.09 3.9 4.2 4.3 2.20 3.11
LPD5030-222ME_ 2.2 ±20% 0.067 78 0.97 0.10 3.1 3.3 3.4 2.15 3.04
LPD5030-332ME_ 3.3 ±20% 0.077 65 0.97 0.10 2.5 2.7 2.8 1.85 2.62
LPD5030-472ME_ 4.7 ±20% 0.111 53 0.97 0.11 2.1 2.2 2.2 1.45 2.05
LPD5030-562ME_ 5.6 ±20% 0.125 48 0.97 0.11 2.0 2.0 2.1 1.35 1.91
LPD5030-682ME_ 6.8 ±20% 0.159 43 0.97 0.12 1.8 1.9 1.9 1.20 1.70
LPD5030-103ME_ 10 ±20% 0.210 31 0.97 0.13 1.3 1.3 1.3 1.05 1.48
LPD5030-153ME_ 15 ±20% 0.298 25 0.98 0.15 1.2 1.4 1.4 0.85 1.20
LPD5030-223ME_ 22 ±20% 0.452 19 0.98 0.17 1.0 1.1 1.1 0.70 0.99
LPD5030-333ME_ 33 ±20% 0.565 15 0.98 0.20 0.8 0.84 0.85 0.60 0.85
LPD5030-473ME_ 47 ±20% 0.806 12.6 0.98 0.24 0.65 0.69 0.72 0.50 0.71
LPD5030-683ME_ 68 ±20% 1.13 10.0 0.98 0.29 0.50 0.54 0.55 0.46 0.64
LPD5030-104ME_ 100 ±20% 1.79 8.32 0.98 0.37 0.47 0.54 0.56 0.35 0.49
LPD5030-154ME_ 150 ±20% 2.43 6.80 0.98 0.46 0.38 0.43 0.45 0.31 0.43
LPD5030-224ME_ 220 ±20% 3.30 5.55 0.98 0.54 0.31 0.35 0.36 0.26 0.37
LPD5030-334ME_ 330 ±20% 5.36 4.05 0.98 0.65 0.25 0.25 0.32 0.20 0.28
LPD5030-474ME_ 470 ±20% 7.51 3.35 0.98 0.76 0.21 0.24 0.26 0.17 0.23
LPD5030-684ME_ 680 ±20% 10.8 2.78 0.98 0.89 0.17 0.20 0.21 0.14 0.19
LPD5030-105ME_ 1000 ±20% 16.5 2.24 0.98 1.20 0.15 0.17 0.17 0.11 0.15
1 When ordering, please specify termination and packaging codes: e.g. LPD5030-105MEC
Termination: E = Silver-palladium-platinum-glass frit
Special order, added cost: T = RoHS tin-silver-copper (95.5/4/0.5) or
S = non-RoHS tin-lead (63/37).
Packaging:

 

 C = 7" machine-ready reel
EIA-481 embossed plastic tape 750 parts per full reel).
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter C instead.
D = 13" machine-ready reel
 EIA-481 embossed plastic tape. Factory order only, not stocked (2500 parts per full reel).
2 Inductance shown for each winding, measured at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR meter or equivalent. When leads are connected in parallel, inductance is the same value. When leads are connected in series, inductance is four times the value
3 DCR is for each winding. When leads are connected in parallel, DCR is half the value. When leads are connected in series, DCR is twice the value.
4 SRF measured using an Agilent/HP 4191A or equivalent. When leads are connected in parallel, SRF is the same value.
5 Isat: DC current, at which the inductance drops the specified amount from its value without current. It is the sum of the current flowing in both windings.
6 Irms, both windings: Equal current when applied to each winding simultaneously that causes a 40°C temperature rise from 25°C ambient. See temperature rise calculation.
7 Irms, one winding: Maximum current when applied to one winding that causes a 40°C temperature rise from 25°C ambient. See temperature rise calculation.
8 Ambient temperature range: –40°C to +85°C with Irms current.
+85°C to +125°C with derated current. Derating curve
9 Storage temperature range: Component: –40°C to +125°C
T&R packaging: –40°C to +80°C
10 Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.
11 Electrical specifications at 25°C.
Refer to Soldering Coilcraft Components before soldering.
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Updated: October 13, 2011